Thermal Interface Material Thickness

Thermal interface materials tims for example thermal conductive gap filling materials are widely used in electronic packaging to reduce the thermal contact resistance caused by the interfacial air whose volume content and thermal conductivity k can be as high as 99 and as low as 0 026 w m 1 k 1 respectively.

Thermal interface material thickness.

Elastomeric pads elastomeric pads are the logical extension of greases. Hsmf is a compressible thermal interface materials made of a non silicone based polymer. While a thermal resistance value quoted for a specific tim part number quite predictably refers to the thickness of that. It is also helpful for die cast heat sinks with poor planarity.

Material thickness is also a factor. Thermal interface materials 65 thermal insulators 15 thermally conductive materials 19 thermal pads. Thermal interface materials tims are a category of products used to aid thermal conduction between mechanically mated surfaces such as a semiconductor device and a heat sink. Polymerized silicone rubbers in the form of easy to handle solids.

As an industry leader in high performance cost effective thermal interface materials tims and technologies laird designs and manufactures thermal products including gap fillers and putties phase change materials thermal greases and thermally conductive insulator materials that meet the demands interface materials tims and technologies laird designs and.